THERMALLY INDUCED WATER MOVEMENT IN UNIFORM CLAYEY SOIL1
نویسندگان
چکیده
منابع مشابه
Thermally induced mixing of water dominated interstellar ices.
Despite considerable attention in the literature being given to the desorption behaviour of smaller volatiles, the thermal properties of complex organics, such as ethanol (C(2)H(5)OH), which are predicted to be formed within interstellar ices, have yet to be characterized. With this in mind, reflection absorption infrared spectroscopy (RAIRS) and temperature programmed desorption (TPD) have bee...
متن کاملThermally Induced Disintegration of
E3d was )ess thermostable than E3c; E3d and E3c lost half of their original activities upon incubations for 30 min at 790C and 900C, respective]y. Heat treatment of E3d raised the fluorescence ;ntensities of Trp residue, intrinsic FAD, and extrinsic 8-anilinonaphthalene-1-sulfonate. E3d lost FAD, and inactive E3d polypeptides were aggregated. The sulfonate bound to the aggregate became notably ...
متن کاملThermally Induced Disintegration of the
E3d was )ess thermostable than E3c; E3d and E3c lost half of their original activities upon incubations for 30 min at 790C and 900C, respective]y. Heat treatment of E3d raised the fluorescence ;ntensities of Trp residue, intrinsic FAD, and extrinsic 8-anilinonaphthalene-1-sulfonate. E3d lost FAD, and inactive E3d polypeptides were aggregated. The sulfonate bound to the aggregate became notably ...
متن کاملFabrication of Gelatin Scaffolds Using Thermally Induced Phase Separation Technique
Gelatin is considered as a partially degraded product of collagen and it is a biodegradable polymer which can be used to produce scaffolds for tissue engineering. Three-dimensional, porous gelatin scaffolds were fabricated by thermally induced phase separation and freeze-drying method. Their porous structure and pore size were characterized by scanning electron microscopy. Scaffolds with differ...
متن کاملThermally Induced Vibration, Circular Plates
1. Tummala RR (2001) Fundamentals of microsystems packaging. McGraw-Hill International Edition, New York 2. JEDEC (2002) Design standard: design requirements for outlines of solid state and related products; JEDEC Publication 95, Design Guide 4.14-1/D, Ball Grid Array Package, JEDEC Solid State Technology Association 3. Vujosevic M (2006) Warpage of flip chip packages. In: Proceedings of IMECE2...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Soil Science
سال: 1996
ISSN: 0038-075X
DOI: 10.1097/00010694-199608000-00001